Charlie is a leader of EM product engineering of multiphysics system analysis at Cadence. He has more than 25 years of experience in semiconductor design and analysis in the EDA industry. He joined Cadence in 2004 as an IC package design consultant to assist multiple IC design companies in Asia Pacific region to build up in-house design and analysis capability. He is a key person supporting TSMC’s reference flow on advanced wafer-level packaging. He is also an expert on interconnect modeling for IC design, 2.5D interposer design, 3DIC design, package, board, and 3D MCAD. Charlie holds a B.S. degree from the Department of Electro-Physics and an M.S. degree from the Institute of Electronics Engineering, National Chiao-Tung University, Hsinchu, Taiwan.