Sponsored By International Manufacturing Services (IMS) Workshop

Techniques for Balancing Power and Frequency Performance for Thick Film RF Terminations

Eastern Time September 12, 2019 11:30 am - 12:00 pm

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Westley Laquerre
J.J. Silvia, III

Designers of RF electronics are often faced with limitations imposed by components. One of the most common limitations is designing very high power while achieving good high RF characteristics. In terms of termination components design approaches including novel resistor and trim geometry, chip orientation, ideal input termination size, and a pre-tuning of DC ohm value to match system impedance at high frequency can be used to optimize balance competing performance parameters. The cost, electrical, and thermal characteristics of Aluminum Nitride vs CVD Diamond can be further compared to investigate what combination of component features produce the most useful combination of resulting component behavior to support next generation RF designs with high power.