Historically, Semi-Additive PCB processing (SAP) has only been available – and practical – for a narrow range of high-volume consumer electronics applications. Now these processes have been implemented at selected facilities in the USA: qualified fabricators can serve a variety of market segments, including high-mix low-volume applications and quick-turn delivery. This breakthrough advancement opens new possibilities for the PCB industry, from design to end-product performance.
Traditional subtractive-etch fabrication processes carry constraints on line width and space, driving complexity in PCB designs constrained with tight pin-out requirements. Advanced semi-additive processes reset that technology curve, allowing fabricators to manufacture with 25-micron trace and space – and below.
This session will open with an overview of the size, weight and power (SWOP) advantages to advanced semi-additive processes, then take a deeper dive: to focus on improvements in signal integrity, performance, and impedance control. There are distinct benefits with taller, narrower traces, so we will introduce design considerations for routing narrower lines. Our session will conclude with real-world case studies, illustrating how these fine feature sizes are successfully applied to realize next-generation electronics.