As 112 Gbps PAM4 data rates become reality, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. In this keynote, Samtec will demonstrate real-world solutions from front-panel to mid-board, mid-board to backplane, high-performance test and on-package system architectures that exceed the demands of next generation data transmission.
