The evolution of high speed signaling technologies along with greater degrees of system integration together apply pressure to the PCB industry to respond with solutions to enable higher performing systems. Standards for chip to chip communication continue to challenge PCB signaling to achieve desired channel reaches.
A PCB is a system solution that must satisfy a broad range of technical requirements including mechanical, thermal, logical/functional, and electrical (signaling and power). Many industry consortia collaborate toward the advancement of PCB technologies and process capabilities.
This talk will provide an overview of these high speed PCB system challenges and illustrate current and emerging PCB materials, manufacturing process, and technology advancements that enable PCB system solutions. Our session will include a projection of signaling media and technologies that will gain traction as high speed needs eventually outstrip PCB bandwidth and reach capabilities.