During the high-level design stages for new a project, board designers are often overwhelmed when trying to choose appropriate diff pair geometry, board material, and stackup to meet high-speed serial link loss budgets. Part of the printed circuit board (PCB) interconnect challenge is modeling transmission lines accurately. Although many EDA tools include the latest and greatest models for conductor surface roughness and wide-band dielectric properties, obtaining the right parameters to feed the models is always a challenge. So how do we get these parameters? Often the only sources are from data sheets. In most cases the numbers do not translate directly into parameters needed for these tools. By using dielectric material properties, copper foil and oxide alternative roughness parameters from data sheets, a practical method of modeling high-speed PCB interconnect is presented.