PCB/ Interconnect Design Technical Session

Avoiding Board Fabrication Pitfalls in High Speed & RF Designs

Eastern Time August 11, 2021 2:30 pm - 3:00 pm

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Julie Ellis

Today’s fine-pitch components and high speed digital and RF designs often push the limits of material and circuit board fabrication capabilities. Creating stack-ups that meet both customer requirements and fabricator capabilities are sometimes like solving multiple-solution puzzles without knowing about all the pieces. This presentation will discuss misunderstood pieces and how things can go wrong when they are not put together correctly. Q&A will include Andy Cameron, Field Applications Engineer at TTM Technologies.