Aerosol Jet Digitally Printed Interconnects for mmWave RF Devices

As the frequency of RF packages climb up and beyond 60 GHz, microstrip and waveguide line widths diminish with substrate thickness and the limitations of traditional interconnect bonding techniques reach their limitations.  Printed 3D Interconnects made with Aerosol Jet® printing provide package designers and RF engineers a new tool to tailor the impedance of transition […]

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