Semi-Additive PCB Process: New Possibilities From PCB Design to Product Performance
Historically, Semi-Additive PCB processing (SAP) has only been available – and practical – for a narrow range of high-volume consumer electronics applications. Now these processes have been implemented at selected facilities in the USA: qualified fabricators can serve a variety of market segments, including high-mix low-volume applications and quick-turn delivery. This breakthrough advancement opens new […]
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