Partial Inductance – The Secret to Correlating Simulation and Measurement

There’s confusion about the measurement of capacitors, and particularly the series inductance or ESL. Different manufacturers calibrate or de-embed their measurement differently, making it difficult to compare one vendor to another. The differences between these measurements represent different locations of the measurement reference plane. When correlating EM simulation and measurement results, where should the reference […]

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Anatomy, Modeling and Simulation of High Performance Vias: Why It Hasn’t Mattered Until Now

Drilled vias are an essential component of high-performance design. However, opinions vary on best practices for designing via transitions. The ultimate design goal of maximum performance and minimum crosstalk while maintaining measurement accuracy can be elusive. In this course, Scott McMorrow will dissect via design, compare via optimization techniques and outline PCB material models necessary […]

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5 Steps to a Real-time Eye Diagram

For digital designers, eye diagrams and its measurements help to analysis quickly how good the signal quality is. However, this can be cumbersome to setup and maybe even daunting to some. Join us, where we quickly go through the basics and then explore the five steps needed to get to a real time eye diagram. […]

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This Is Why You Need To Worry About Terminations

The first rule of engineering transmission lines is to build a controlled impedance interconnect. The second rule is to implement a termination strategy for the interconnects based on the routing topology and the drivers and receivers. In our Advanced PCB Design class, we use a simple demonstration test board to illustrate the perils of bad […]

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The Influence of Connectivity on Low Impedance Measurements

Engineers connect a VNA to a circuit board for low-impedance measurements using a variety of methods. These methods primarily include connectors, probes, and soldered pigtails. Each of these methods has advantages and disadvantages, and no one solution is best in all cases. In this session both qualitative and quantitative assessments are presented for each method, […]

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Achieving 10X Performance for Next-Generation Signal and Power Integrity Analysis

Cadence® Sigrity™ X, the latest signal integrity (SI)/power integrity (PI) software release, includes faster engines, distributed computing, and a new user interface. In addition, a new methodology for performing PI across multiple fabrics is now available. This presentation introduces how the new Sigrity X distributed computing architecture is meeting the demands of SI/PI engineers across […]

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Antenna and Circuit Modeling for High-Speed Communication in 5G and SatCom Applications

The performance of microwave and millimeter-wave antennas and circuits plays a key role in the application area of satellite communication and the 5G mobile network for high-data-rate communication. The evaluation of such devices before fabrication and testing through electromagnetics simulation tools is beneficial to reduce the time and effort required in the design process during […]

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Power Integrity: Layer Stackup and Decoupling to Achieve a Target Impedance

There are many choices in PCB power integrity design to achieve a specified voltage ripple, or target impedance. For the power net, this includes on which layer(s) to locate it, spacing between the power net and closest ground, and special materials for embedded capacitance. For decoupling, design choices include capacitor location, value(s), interconnect geometry, and […]

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Fear, Uncertainty and Doubt – An Irreverent View of 224 Gbps Channel Data Rates

The road to 224 Gbps channel data rates is filled with twists, turns and fender-rattling potholes. Design challenges including modulation schemes, IC packaging, breakout regions, PCB stack-up, laminate selection, mechanical concerns, thermal mitigation and more are obstacles that must be overcome. In this keynote, Samtec will review the roadblocks of 224 Gbps performance while presenting […]

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