Extracting high-quality S-parameters for a DUT from measurements inherently involves de-embedding them from a total structure that includes test fixture lead-ins. These lead-ins typically include probes or connectors, and potentially some length of non-coaxial transmission-line, e.g., stripline or microstrip on a PCB, as well as via transitions, in addition to the DUT. A common current […]
Read moreJulie will discuss trade-off analysis performed by the printed circuit board fabricator when creating a complex stack-up. You will learn how design features required by the customer, such as min pitch BGA, material Dk/Df, drill structures, number of layers, layer copper thicknesses, and controlled impedances interplay in the final stack-up calculations to determine whether the […]
Read moreThe normal variation of several processes within circuit fabrication, can have multiple influences on RF performance. For some situations, the RF influence due to a process having normal variation can be significant at lower frequencies and less influential at higher frequencies. However, it is more common for the higher frequency applications to be more influenced […]
Read moreInductance is an intrinsic property of current carrying conductors and is often explained by induction. But this does not work for DC. It is much more straightforward to understand the inductance in terms of the magnetic field. Ferrite clamps are used to filter common mode currents and they are often explained by losses. But that […]
Read moreRF/microwave IP, developed in a specialized design environment, must be transferred to a PCB layout editor where manufacturing constraints, design rule checking (DRC), layout vs. schematic (LVS) and corporate-approved components can be applied and integrated with the power and digital electronics. The transfer of RF design data (schematic and layout) is tyopically re-entered manually by […]
Read moreWhen doing stackup and impedance modeling, we need to get the dielectric material properties from the right sources. One important parameter for accurate impedance modeling is the dielectric constant or simply Dk. In this presentation the difference between simple laminate suppliers’ marketing data sheets and engineering data sheets are discussed as well as how anisotropic […]
Read moreIn designing via breakouts for BGAs, connectors and freestanding via transitions, engineers may box themselves into a corner where layout is exceedingly difficult. Designers may also fall into the “mole hole” of endless optimization simulations that seem more like a game of “Whack-a-Mole” than a design methodology. This presentation will provide a simplified process that […]
Read moreMany systems are integrating capabilities that require mmWave beamforming. Example application areas include suites of sensors, 5G/6G systems, radar, and SATCOM. In this presentation, a review of best design practices surrounding interconnect design required to route signals into phased array structures required in these application areas will be presented. The core of this presentation will […]
Read moreAt 224Gbps data rates, test fixtures and PCB materials must improve. Using a target of 67GHz for high-quality s-parameter measurements, various PCB materials and test fixtures are evaluated. The evaluations include low-loss dielectrics, smooth PCB copper, and 1.85mm co-ax fixtures. These are combined to make PCB trace measurements, plus co-ax and twinax cable measurements. De-embedding […]
Read moreThe evolution of high speed signaling technologies along with greater degrees of system integration together apply pressure to the PCB industry to respond with solutions to enable higher performing systems. Standards for chip to chip communication continue to challenge PCB signaling to achieve desired channel reaches. A PCB is a system solution that must satisfy […]
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