Aerosol Jet Digitally Printed Interconnects for mmWave RF Devices

As the frequency of RF packages climb up and beyond 60 GHz, microstrip and waveguide line widths diminish with substrate thickness and the limitations of traditional interconnect bonding techniques reach their limitations.  Printed 3D Interconnects made with Aerosol Jet® printing provide package designers and RF engineers a new tool to tailor the impedance of transition […]

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Avoiding Board Fabrication Pitfalls in High Speed & RF Designs

Today’s fine-pitch components and high speed digital and RF designs often push the limits of material and circuit board fabrication capabilities. Creating stack-ups that meet both customer requirements and fabricator capabilities are sometimes like solving multiple-solution puzzles without knowing about all the pieces. This presentation will discuss misunderstood pieces and how things can go wrong […]

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What Is DFX, Why Is It so Important, and Who Should Do It?

How much do you want to spend on your design? Do you rely on the fabricator and assembler to know what you want for your finished PCB?  If so, there is something you should know:  They know THEIR job, they don’t know YOUR design. The first priority of most fabrication and assembly companies is to […]

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RF Performance Comparisons between Microstrip and Grounded Coplanar Waveguide at mmWave Frequencies

It is common for RF applications using PCB technology at microwave frequencies to use microstrip circuit structures. However, as the frequency increases, at higher microwave frequencies and millimeter-wave (mmWave) frequencies, there are increased RF performance issues for the RF designer to consider. In theory, the Grounded Coplanar Waveguide (GCPW) circuit structure addresses many of the […]

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Building and Using Numerical and Analytical Models in PCB Interconnect Optimization

PCB optimization focuses on designing boards to meet specific performance metrics while satisfying specific design constraints. In particular, interconnect design requires satisfying multiple design objectives and constraints that may be in conflict, and engineers need tools and methods to help them balance design these objectives while staying within their design constraints. For ultra-high-speed boards, designers […]

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HDI Usage Considerations

With the pitch of parts getting tighter and the pin count of BGAs going up, there is a need to get as much routing as possible into very dense areas of the board. HDI helps many people accomplish that, by allowing a much larger number of signals to escape the BGAs. However, there are a […]

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Accelerating RF PCB System Development

Most RF/mixed-signal PCB design and system integration requires a workflow that not only supports interoperability between the design tool responsible for RF/microwave IP creation and the manufacturing/signoff platform, but also properly manages SMD library parts, padstacks, and technology files in order to avoid time-consuming, error prone, manual translation flows. This presentation will examine the requirements […]

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Ground Stitching and Copper Balancing for High Performance SI Evaluation Kits

High-performance I/O interfaces offer small design margin for physical channel impairments such as routing impedance discontinuities and crosstalk. Mitigation techniques commonly deployed in single-purpose test/evaluation boards include thieving pads (copper balance and etch control) and stitching vias (crosstalk reduction and optimal return path). For critical high-speed nets, best practices combine these as “stitched thieving” in […]

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Benchtop Troubleshooting Process for Radiated Immunity

Radiated immunity has started to become very common and is nearly impossible to set up in-house without great expense and trained test operators. Often it involves endless cycles back and forth between adding random fixes in-house and then running back to the compliance test lab. This delay can negatively affect product introductions. This presentation will […]

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Semi-Additive PCB Process: New Possibilities From PCB Design to Product Performance

Historically, Semi-Additive PCB processing (SAP) has only been available – and practical – for a narrow range of high-volume consumer electronics applications. Now these processes have been implemented at selected facilities in the USA: qualified fabricators can serve a variety of market segments, including high-mix low-volume applications and quick-turn delivery.  This breakthrough advancement opens new […]

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