The road to 224 Gbps channel data rates is filled with twists, turns and fender-rattling potholes. Design challenges including modulation schemes, IC packaging, breakout regions, PCB stack-up, laminate selection, mechanical concerns, thermal mitigation and more are obstacles that must be overcome. In this keynote, Samtec will review the roadblocks of 224 Gbps performance while presenting […]
Read moreAutomotive OEMs are moving towards the inclusion of several safety systems, which are covered by several sensors. Many new functions are being added to assist the driver to avoid accidents that might be caused by different road scenarios. The new ADAS (Advanced Driver Assistance Systems) systems are mainly: lane change assistants (LCA), blind spot detection […]
Read moreHistorically, Semi-Additive PCB processing (SAP) has only been available – and practical – for a narrow range of high-volume consumer electronics applications. Now these processes have been implemented at selected facilities in the USA: qualified fabricators can serve a variety of market segments, including high-mix low-volume applications and quick-turn delivery. This breakthrough advancement opens new […]
Read moreThe disaggregation of the radio access network (RAN) into multiple subsystems with open interfaces between them is revolutionizing the cellular wireless architecture. With the O-RAN Alliance, Telecom Infrastructure Project (TIP), and other bodies leading the way, the industry is witnessing a burst of activity in standardizing the behavior of Open RAN interfaces, facilitating the development […]
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