Interactive Radar: Algorithmic Perspective

Radar has evolved from a complex, high-end aerospace technology into a relatively simple, low end solution penetrating industrial, automotive and consumer market segments. This rapid evolution has been driven by two main factors: advancements in silicon and packaging technology that has led to miniaturization, and growth of computing power that has enabled the use of […]

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Stretching the Limits of PCB Design

Expanding markets, such as automotive, IoT, wearables, and healthcare, continue to drive innovation in printed circuit board and interconnect design. While new materials and technologies are being stretched to their limits, some fascinating new design and manufacturing methods are offering completely new ways to create PCBs, eliminating some of the old trade offs and revealing […]

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Filtering mmW Frequencies with LTCC Technology

As more commercial applications gravitate toward mmWave frequency bands (30 to 300 GHz), an increasingly crowded RF spectrum will require some adaptation of legacy technologies. In particular, the approaching rollout of fifth generation (5G) wireless up to 40 GHz and beyond, as well as a growing number of Satcom systems in the Ka band (26 […]

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Metamaterial Electronically Steering Antennas: Enabling High-Performance Radar in the Age of Autonomy

Electronic beam-steering phased-array antennas (ESA’s) are the gold-standard of performance in radar and communications.  Unfortunately, there are longstanding challenges to realizing low-cost phased-arrays, and as a result many applications have to make-due with lower-performing antennas.  Recently, new antenna architectures leveraging dense metamaterial design are changing that, offering high-performance ESA’s at breakthrough cost, which is in […]

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System Oriented Testing for Memory Interfaces

Next-generation data center and server architectures rely heavily on high-speed signaling interfaces. No longer restricted to the networking sub-systems of the data center, these high-speed interfaces are used to connect processors, AI hardware accelerators, switching and routing fabrics, and of course extremely high-density memory channels. Testing these highly parallel signaling interfaces represents a particular challenge […]

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Developing Wireless PCB Applications with EM Verification and an RF Design Flow

Today’s PCB designers face multiple challenges incorporating RF/microwave, analog, and digital design elements together on the same PCB. To successfully integrate RF/microwave content and mixed-signal designs, PCB layout tools and RF circuit design software must exchange design data efficiently. This workshop will address two aspects to successful RF PCB design, namely EM verification as well […]

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Update Your SI / PI Design and Analysis Methodology for DDR and GDDR Memory Interfaces

Memory interfaces continue to be the biggest challenge for signal and power integrity teams.  Simultaneous switching of single-ended signals at the speeds of serial links take this design challenge to a new level over the well-behaved differential pairs of peripheral component interconnect express (PCI Express).  With voltage swings below one volt for the low-power versions […]

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Using TDR to Solve Signal Integrity Issues

Gone are the days where only basic voltage and timing measurements would suffice for validating a high-speed design. Large-scale design integration with devices such as SoCs or FPGA require strict impedance control, tight timing references and a host of other complex parameters to manage. How do you efficiently address signal integrity issues? Where do you […]

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PAM-Fried Engineer’s Guide to Crosstalk, ISI, FEC, Equalization

In this talk, we’ll see how crosstalk, ISI (inter-symbol interference), FEC (forward error correction), and equalization have driven high speed IO away from NRZ (which should be PAM2–2-level pulse amplitude modulation) to the madness of PAM4, PAM5, PAM6, PAM-fried engineers. Along the way, we’ll investigate how simple, righteous design constraints have evolved to arbitrarily complicated […]

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Exploring Power Dissipation Thermal Ratings for Fixed Attenuators

A number of thermal/power design challenges are found when PCB Designers evaluate the use of fixed attenuators. It is helpful to explore and understand relationships of applied power, dissipated power and the factors involved across multiple dB values of attenuators whether fixed in a component network or created using discrete individual resistors on a PCB. […]

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